We are investigating to understand the fundamental principles in multidisciplinary subjects, primarily focused on metrology, inspection, and instrumentation, by leveraging our core knowledge in manufacturing, precision engineering, metrology, mechatronics, and optics. Our primary academic interests are to develop precision engineering-inspired approaches to manufacturing and metrology and, reciprocally, to use these approaches to understand learning better and create new knowledge in precision machine systems. We try any possible approaches to solving the current manufacturing problems and characterizing those limits, such as accuracy, precision, long-term reliability, and fatigue properties. We train future semiconductor/subtractive/additive metrology and manufacturing workforce and offer technical solutions to the industry.
Area of Research
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Semiconductor metrology and inspection tool development
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Through Si/Glass via metrology and inspection
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Wafer/Mask metrology and inspection
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Die-/Wafer-to-wafer bonding layer characterization and modeling
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Interferometry for length, surface, and volume measurements
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Optical/Electric/Magnetic spectroscopy
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Vision-based 3D imaging
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Machine tool metrology (linear axes, spindles, tool wear, surface profile)
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Sensors and instrumentation (for dimensional measurement and on-machine measurement)
Sponsors and Collaborators
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Federal Agencies: National Science Foundation (NSF); National Institute of Standards and Technology (NIST); Oak Ridge National Lab (ORNL); Los Alamos National Lab (LANL)
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Industry: Denso, Honeywell Federal Manufacturing, Nanocue Technologies, Tri-N, Labpisode, Samsung Electronics; LG Electronics; Semiconductor Research Corporation (SRC)
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International: The University of Tokyo, Korea Institute of Industrial Technology (KITECH); Korea Institute of Advancement of Technology (KIAT)