Topic 0: Glass interposer metrology and inspection (unconventional 3D imaging)
Topic 1: TSV/TGV metrology by unconventional interferometry
Topic 2: Defect mode (air bubbles, particles, potential pattern errors, etc.) inspection of hybrid bonded wafers by thermography and thermo-acoustic spectroscopy
Topic 3: Hybrid bonded wafer layer inspection by Electro-chemical Impedance Spectroscopy (EIS)
Topic 4: Wafer-chuck geometric compliance design for CD enhancement in lithography
Topic 5: LER/VER characterization by waveguide-based darkfield microscopy
Topic 6: Thin-film warpage metrology by reflection spectroscopy
Topic 7: Battery cell defect inspection by photoacoustic spectroscopy
Previous Research
Wafer metrology and inspection
Wafer bonding layer metrology and inspection
Via metrology and inspection
Photomask metrology and inspection
Metrology-guided repair engineering
3D Thermography for surface metrology
Strobo-stereo-spectroscopy
Machine tool metrology for manufacturing process control and automation
Cutting tool wear measurement and instrumentation
3D Particle inspection and classification
Nondestructive testing and instrumentation